Ti-Tungsten TiW-30
Ti-Tungsten TiW-30 is a selective etchant for titanium-tungsten adhesion layers in microelectronics applications. TiW-30 effectively etches Ti-tungsten films deposited on silicon nitride, or silicon oxide. TiW-30 provides excellent definition and etch rate control. Broad compatibility with positive and negative photoresists is offered.
APPLICATION:
Ti-Tungsten TiW-30 etchant is a ready-to-use solution specifically designed to remove titanium-tungsten alloy adhesion layers from substrates such as silicon dioxide and silicon nitride. TiW-30 will not attack aluminum films. Heating the etchant to 40¡ÆC will speed the etch rate for thicker films.
PROPERTIES:
| TiW-30
| |
Appearance | Water white |
Shelf Life | 2 months @ 25¡É 6 months @ 0¡É |
Storage | 0 ¡É |
Rinse | Deionized Water |
Operating Temperature | 25 - 40 ¡É |
Etch Rate @ 25¡É | 10-15 ¡Ê/sec (immersion) |