TANTALUM ETCHANTS 111
Transene Tantalum Etchants 111 is high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications. Tantalum Etchant 111 is a slower etching solution for optimum control and is more effective for removing tantalum oxide layers. Tantalum Etchant 111 is filtered to remove all particulates above 0.2 microns.
PROPERTIES :
| Tantalum Etch 111 | |
Appearance | Clear |
Solubility | Infinite in water |
Filtration | 0.2 microns |
Operation | 25 ¡É |
Etch Rate (Ta) @ 25¡É | 30-40 ¡Ê/sec |
Storage | Room Temperature |
Shelf Life | 1 Year |
Mask Materials | Gold; Positive or Negative |
Rinse | Deionized Water |
APPLICATION:
Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity. Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation. Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.