Palladium Etchant
Palladium Etchant TFP is designed for high resolution pattern delineation of sputtered, evaporated and electrolessly deposited films. These films are commonly employed barrier layers for silicon wafer metalization systems of nickel and gold.
PROPERTIES :
| Palladium ETCH TFP | | Appearance | Dark Amber Aq. Sol. | pH | < 1 | Flash Point | Non-Flammable | Storage | Room Temperature | Shelf Life | 1 Year | Toxicity | Acid |
OPERATION :
Tank | Glass/Pyres/PVC | Temperature | 40-60¡É | Etch Rate | 110¡Ê/sec @ 50¡É | Rinse | Water | Compatible Resists | Nega & Posi | Metallization | Gold/Ni-gold |
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