Nichrome Etchants TFC and TFN
Nichrome Etchants TFN and TFC are designed for etching nichrome thin films in microelectronics applications. Nichrome Etchants are compatible with positive and negative photoresists and provide fine-line control with minimal undercutting. High purity formulations filtered to 0.2 micron are well suited to critical microelectronic applications.
NICHROME ETCHANT TFC
Slower etch rate for precise control.
NICHROME ETHCANT TFN
Minimal undercutting with excellent fine-line control. Consistent operation.
FEATURES:
* High purity
* 0.2 micron filtration
* Compatibility with positive and negative photoresists
* Fine line controlUniform etch rate
Transene Nichrome Etchants TFC and TFN are high purity systems based on ceric sulfate and ceric ammonium nitrate, respectively. Nichrome Etchants provide clean, precise etching of evaporated nichrome layers for the preparation of thin film circuits. Nichrome Etchants contain semiconductor grade ingredients for ultra-high purity and are filtered to 0.2 microns to remove particulates.
PROPERTIES :
| TFC | TFN |
Appearance | Clear orange | Clear orange |
Chemistry Base | Ceric Sulfate | Ceric Ammonium Nitrate |
Specific Gravity | 1.09-1.10 | 1.127-1.130 |
Filtration | 0.2 microns | 0.2 microns |
Operating Temperature | 25¡É | 40¡É |
Etch Rate | 30¡Ê/sec @ 25¡É | 50 ¡Ê/sec @ 40¡É |
Etch Capacity | 168 g/gal | ----- |
Rinse | 1% Sulfuric acid/deionized water | Deionized water |
APPLICATION:
Nichrome Etchants may be operated at room temperature or elevated temperature to increase etch rates. Nichrome Etchant TFC may require a rinse with 1 % sulfuric acid followed by a deionized water rinse to remove etch residue. Nichrome Etchant TFN is an improved formulation which etches more cleanly, eliminating the need for an intermediate rinse.