Moly Etchant - TFM
Selective etchants for molybdenum and tungsten thin-film metallizations used in semiconductor and microelectronics technology. TFM and TFW selective etchants are buffered, mildly alkaline ferricyanide-based formulations providing high resolution patterns with minimal undercutting and photoresist compatibility. Controlled, uniform etching is achieved by immersion or spray etch technique.
PROPERTIES :
| MOLY ETCH TFM | TUNGSTEN ETCH TFW |
Appearance | Amber, aqueous solution | Amber, aqueous solution |
pH | 10.0 | 8.0 |
Dilution | Distilled Water | Distilled Water |
Compatible Photoresists | Negative: PKP KMER,KTFR,KPR | Negative & Positive |
Rinse | Distilled Water | Distilled Water |
Flash Point | Non-Flammable | Non-Flammable |
| Mo | W |
Etch Rate | ----- | 30 ¡Ê/sec (Immersion) |
20¡É | ----- | 80 ¡Ê/sec (Spray) |
30¡É | 55 ¡Ê/sec | 140 ¡Ê/sec |
60¡É | 85 ¡Ê/sec | 250 ¡Ê/sec |
Etch Capacity | 30 grams/gallon | 64 grams/gallon (10,000 in2/5000¡Ê thick) |