Nickel Etchant TFG
TRANSENE Thin Film Nickel Etchant is high purity nitrate based formulations for superior etching of electroplated nickel films.
Nickel Etchants are compatible witch both positive and negative photoresist materials.
Recommended resists include AZ-111, AZ-1350 OH, and KMER.
Nickel Etchants are commonly employed in the manufacture of resistor boards where films of gold, nickel, and nichrome or chromium are to be etched.
Nickel Etchant TFG is compatible with copper.
COMPARIBILITY :
| Al | Au | Cr | Cu | Ni | Si | Si3N4 | SiO2 | Ti | W | GaAs | Ta/TaN |
Ni TFG | Etch | Ok | Ok | Ok | Etch | Ok | Ok | Ok | Ok | Ok | Ok | Ok |
Etch = significant attack / Slight = Slight attack / Ok = No Attack / Surf ox = Surface Oxidation /
Corrode = Surface Corrosion
Selectivity of about 10:1 for "slight" and selectivity > 1000:1 for "ok" or "no attack"
PROPERTIES :
| Nickel Etchant TFG
| |
Appearance | Clear, Colorless |
Operating Temperature | 40¡É |
Typical Film Thickness | ---------------- |
Resist compatibility | Nega & Posi |
Etch Rate | 50 ¡Ê/sec |
Tank | Glass |
Nickel Deposition | Electroless / Electroplated |
Etch Capacity | ---------------- |
APPLICATION :
• Nickel Etchants are supplied ready to use as immersion type etchants.
• Etch rates may be controlled via operating temperature.
• Nickel is normally sandwiched between gold and nichrome or chromium on an alumina substrate.
Either evaporative or electroless nickel may be employed.
• Actual etch is related to film thickness and operating temperature but is typically approximately one minute for evaporative nickel and about for minutes for electroless nickel.
• Etching should be followed with a deionized water rinse.