NICKEL ETCHANT TYPE I
Nickel Etchant Type I is a high purity etchant for nickel, nickel-iron alloys, iron, iron oxide, and some types of stainless steel. Copper is also etched by Nickel Etchant Type I. Compatible with a wide range of photoresists (including KPR, Dynachem, AZ, Riston, and Screen Resists). Nickel Etchant Type I contains metal chelating ingredients for optimal performance. Nickel Etchant Type I will not attack gold films.
PROPERTIES:
Operating Temperature
| 30-60oC
|
Tank
| Glass
|
Rinse
| Water
|
Etch Rate, Nickel Boron
| 3.2 mil/hr @ 40oC
|
Etch Rate, Nickel-Phosphorus
| 1.0 µ/hr @ 40oC
|
Etch Rate, Pure Nickel
| 4.8 mil/hr @ 40oC
|
Etch Rate, RTM Nickel
| 3.2 mil/hr @ 40oC
|
Etch Rate, Ni-Fe
| 400 Å/sec @ 50oC
|
Etch Rate, Stainless Steel
| 45 Å/sec @ 25oC AISI 316
|
| 105 Å/sec @ 30oC AISI 316
500 Å/sec @ 45oC AISI 304
|
Etch Rate, Fe2O3
| 50 Å/sec @ 50oC
|
Etch Rate, Cu
| 1 mil /min @ 40oC
|
Agitation
| Continuous, mild
|
APPLICATION:
Nickel Etchant Type I is used at elevated temperatures, typically 30-60oC. Continuous agitation is required for uniform, consistent results. A variety of metal, metal alloy, and metal oxide materials may be etched with Nickel Etchant Type I. The etch rate varies with metal content and purity.
