COPPER ETCHANT CE-100
Transene Printed Circuit Copper Etchants (CE-100) are ferric chloride solutions formulated with proprietary wetting antifoam plus chelating additives to optimize etching performance. Ferric chloride solutions are the most widely used etchants for copper, copper alloys and Kovar in printed circuit board applications. The etchants are highly compatible with commonly used photoresists (KPR, DYNACHEM, AZ, RISTON, SCREEN RESISTS, etc.) These etchants should not be used when solder-plated resists are employed.
suitable for Thin Film circuits. Additionally, compatibility with nickel and tin-lead solders
| - |
CE-100 |
Remark |
| Etchant Type |
Immersion Dip or Spray |
|
| Operatioin Remperature |
40-60oC |
|
| Etch Rate @40Oc |
1 mil/min |
|
| Time To etch 1oz. copper |
1 1/2 min. |
|
| Etch capacity |
19 oz. Cu/gal. |
|
APPLICATION:
Copper Immersion Etchant (CE-100) is supplied ready-to-use. Recommended operating temperature is 40-60oC. Many users discard spent etchant at 50% solution exhaustion (i.e. after etching is 8-10 oz. Cu Metal/gal.) and replace with fresh etchant.
After etching 8 oz. Cu metal/gal. etch rates may become longer than desired. Addition of 500 ml HCl (37%) per
gallon of etchant will effectively increase etch rate and allow use of etchant to 70% solution exhaustion (14 oz. Cu metal/gal.) Agitation of work in the etchant bath is advisable and will increase etch rates and improve definition.
ETCHING TANK AND EQUIPMENT - DISPOSAL OF SPENT ETCHANT
Use PVC, glass, or epoxy-coated tanks. Heaters may be quartz, carbon or titanium (nickel or cobalt-steel may also be used). Neutralize spent CE-100/200 with calcium carbonate and dilute with water. Sewer disposal is not recommended.
