NICKEL ETCHANT TFB
TRANSENE Thin Film Nickel Etchant TFB´Â Evaporated, Electroplated Nickel ¹Ú¸·ÀÇ ¿¡ÄªÀ» À§ÇÑ °í¼øµµÀÇ Nitrate baseÀÇ Á¦Ç°ÀÔ´Ï´Ù.
TFB´Â Negative & Positive Photoresist¿¡ ¸ðµÎ »ç¿ë °¡´ÉÇÕ´Ï´Ù.
Ãßõ Resist¿¡´Â AZ-111, AZ-1350 OH, KMERÀÔ´Ï´Ù.
Nickel Etchants´Â Gold¹Ú¸·À» AttackÇÏÁö ¾Ê½À´Ï´Ù. ÁÖ·Î Resistor BoardsÀÇ Á¦Á¶¿¡ »ç¿ëµÇ¸ç, Nickel, Nichrome ¶Ç´Â Chrome, ChromiumÀÇ Etching¿¡ »ç¿ëµË´Ï´Ù.
COMPATIBILITY :
| Al | Au | Cr | Cu | Ni | Si | Si3N4 | SiO2 | Ti | W | GaAs | Ta/TaN |
Ni TFB | Etch | Ok | Etch | Etch | Etch | Surf ox | Ok | Ok | Ok | Ok | Etch | Ok |
Etch = significant attack / Slight = Slight attack / Ok = No Attack / Surf ox = Surface Oxidation /
Corrode = Surface Corrosion
Selectivity of about 10:1 for "slight" and selectivity > 1000:1 for "ok" or "no attack"
PROPERTIES :
| Nickel Etchant TFB
| |
Appearance | Clear, Colorless |
Operating Temperature | 25¡É |
Typical Film Thickness | 1500¡Ê/5-50 micro inch |
Resist compatibility | Nega & Posi |
Etch Rate | 30 ¡Ê/sec |
Tank | Glass |
Nickel Deposition | Evaporated / Sputtered |
Etch Capacity | 270 grams / gal |
APPLICATION :
• Nickel Etchants´Â ¹Ù·Î »ç¿ëÇÒ ¼ö ÀÖ´Â Immersion TypeÀ¸·Î Á¦°øµË´Ï´Ù.
• Etch ratesÀº Operating Temperature·Î Á¶Àý °¡´ÉÇÕ´Ï´Ù.
• NickelÃþÀº º¸Åë Alumina SubstratesÀ§¿¡ Gold¿Í Nichrome ¶Ç´Â ChromiumÃþ¿¡ ¼¾µåÀ§Ä¡ ±¸Á¶·Î ÀÌ·ç¾îÁ® ÀÖ½À´Ï´Ù.
¶ÇÇÑ NickelÃþÀº Evaoprative ȤÀº Electroless °ø¹ýÀ¸·Î ¸¸µé¾î Áý´Ï´Ù.
• ½ÇÁúÀûÀÎ Etch´Â ¹Ú¸·ÀÇ µÎ²²¿Í Operating Temperature¿¡ µû¶ó¼ Ʋ·ÁÁý´Ï´Ù. Åë»óÀûÀ¸·Î Evaporative NickelÀº 1ºÐ, Electroless NickelÀº 4ºÐÀÔ´Ï´Ù.
• Etching ÈÄ¿¡´Â DI Water¸¦ ÀÌ¿ëÇÏ¿© RinseÇÕ´Ï´Ù.