SURFACE MOUNT ADHESIVES
Low cost, high density packaging of integrated circuits, lead-less chip carriers, and chip component attachment for ceramic substrates and PC Boards
TRANSENE SMA EPOXY ADHESIVES are formulated specifically for precision mounting of flat pack semiconductor devices, chip capacitors and resistors in the production of complex hybrid circuits.
Preliminary physical attachment (staking) prior to wave soldering leaded devices or the direct mounting of descrete components and microwave devices (dual-inlline pack) is feasible for both electrically conductive and non-conductive attachment.
TRANSENE SMA EPOXY ADHESIVES include 1 and 2 part systems, color coded as required, supplied in customized packages to interface application techniques for auto-dispensing or screen printing. The various formulations offer non-corrosive systems with good handling characteristics: thixotropy resistant to trailing/stringing and adequate body to fill gaps and crevices. Quick cure, good adhesion, ability to withstand mechanical and thermal stress, wave soldering temperatures and clean-up solvents provide for wide application.
Color customizing available.
PROPERTIES
| | SMA-100 | SMA-200 | SMA-300 | SMA-400 | SMA-500 | SMA-600 | SMA-700 |
| Feature | High
Thermal
Conductivity | Low
Moisture
Absorbtion | Staking
Compound
Quick Cure | High Thermal
low Temp
Cure | Standard | Low Temp
Cure | Long Pot Life |
| Application | Auto-
Dispensing | Auto-
Dispensing | Dispense | Auto-
Dispense | AutoDispense
Screen Print | Auto-
Dispense | AutoDispense
Screen Print |
| Composition | 1 part/filled | 1 part/filled | 2 part /
unfilled | 2 part/filled | 1 part | 2 part | 2 part |
| Color | Red | Green | Amber | Black | Smooth silver
paste | Smooth silver
paste | Smooth silver
paste |
| Viscosity | 100,000 cps | 90,000 cps | 20,000 cps | 70,000 cps | 80,000 cps | 90,000 cps | 90,000 |
| Shelf-Life @25℃ | 6 months | 6 months | 6 months | 6 months | 6 months | 12 months | 12 months |
| Thermal Cond. BTU/hr/ft2/℉ | 12 | 4 | --- | 10 | 75 | 80 | 80 |
| Coef. of thermal exp(in/in/℃x10-6) | 23 | 30 | --- | 20 | 50 | 60 | 60 |
| Lap shear | 1500 psi | 2000 psi | 2000 psi | 2000 psi | 1500 psi | 1500 psi | 1500 psi |
| Moisture Absorption | 0.14% | 0.05% | --- | 0.17% | --- | --- | --- |
| (7 day imm. @25℃) | | | | | | | |
| Vol resistivity (ohm/cm) | 1 x 10-16 | 1 x 10-15 | 1 x 10-15 | 1 x 10-4 | 1 x 10-4 | 1 x 10-4 | 1 x 10-4 |
| Dielectric strength v/mil | 500 | 450 | 400 | 450 | --- | --- | |
| Mix Ratio | --- | --- | 1:1 | 100:7 | --- | 100:3.6 | 100:2.5 |
| Cure | 115℃-30min | 115℃-30min | 25℃-hr | 50℃-20min | 125℃-1hr | 50℃-30min | 100℃-10min |
| 135℃-1 min | 135℃-15min | --- | 75℃-10min | 150℃-5min | 75℃-15min | 125℃-5min |
| Pot Life | --- | --- | 10 min | 3 hrs | --- | 2 hrs | 40 hrs |
