SILVER-MET
Silver Metallizations for Non-Metals
Silver-filled, air-drying polymer formulations designed to provide high conductivity metallizations on plastics, paper, mica, ceramic and other non-conductive materials.
SILVER-MET 145
• Brush, dip or spray application
SILVER-MET 170
• Brush, dip or spray application
• High silver density
SILVER-MET 270
• Screen print application
SPECIAL APPLICATIONS
• Tantalum capacitor terminations
• Shielding against RF/EMI
TRANSENE SILVER-MET formulations are silver-filled, air-drying polymers designed to provide high conductivity metallizations on plastics, paper, mica, and other non-conductive surfaces. The silver film allows direct soft-soldering without the use of flux. The film also permits subsequent metallizations through the electroplating process.
SILVER-MET is suggested for use in electronics and microwave applications for connectors, contacts, magnetic shielding, capacitor terminations, etc.
The product is most effective for RF/ EMI shielding because it reflects as well as absorbs energy. For tantalum capacitors, SILVER-MET functions uniquely as terminations for the capacitor.
PROPERTIES
| | TYPE 145 | TYPE 170 | TYPE 270 |
| Application | Dip / Spray | Dip / Brush | Screen print |
| Silver Content | 45% | 70% | 70% |
| Viscosity (cps) | 500 | 45,000 | 150,000 |
| Thinner | Butyl Acetate | Butyl Acetate | Butyl Carbitol Acetate |
Sheet Resistance
(milli-ohms/sq/mil) | 160 | 160 | 160 |
| Service Temperature | -30℃ to 110℃ | -30℃ to 110℃ | -30℃ to 110℃ |
| Drying Time @25℃ | 20 hours | 20 hours | N/A |
| Drying Time @80-125℃ | 1 hour | 1 hour | 1 hour |
APPLICATION
SILVER-MET 145 and SILVER-MET 170 may be applied by brush, dip or spray techniques. After application, substances should be allowed to level and air-dry at room temperature for 1/2 hour to 1 hour, then baked at 80℃ to 100℃ for 1 hour to obtain complete drying.
SILVER-MET 270 may be applied by screen printing using standard 180 to 200 mesh screen. After application substrates should be allowed to level for 5 to 10 minutes, then baked at 80℃ to 125℃ for 1 hour to obtain complete drying.
Silver-MET 170 and 270 provide a metallic base for direct soft-soldering at temperatures up to 190℃. TYPES 145, 170 and 270 provide a suitable base for further metallization by electroplating.
