MICROCIRCUIT SILVERS
for conductive Bonding in Microelectronics
One-part tehrmosetting silver epoxy systems for conductive bonding in microelectronic assembly operations.
MICROCIRCUIT SILVER - TYPE K
Low temperature, fast cure-automatic despensing
MICROCIRCUIT SILVER - TYPE L
Low temperature, fast cure-screen print
MICROCIRCUIT SILVER - TYPE N
High bond strength - 100% solids
MICROCIRCUIT SILVER - TYPE O
High electrical conductivity - 100% solids
MICROCIRCUIT SILVERS are one-part, thermosetting silver-epoxy compositions designed spedifically for conductive bonding in microelectronic assembly operations. Recommended applications include the conductive bonding of integrated circuit chips, capacitors, and other active and passive components.
MICROCIRCUIT SILVERS meet Hi-Rel requirements for low outgassing, bond strength, and electrical conductivity.
MICROCIRCUIT SILVERS withstand temperatures up to 350℃, allowing ultrasonic and thermal compression bonding of interconnecting wires. MICROCIRCUIT SILVERS TYPES K and L, will fully cure in 15 seconds at 300℃; thus these silver compositions possess the unique ability to cure during thermal compression binding operations.
Several modifications of MICROCIRCUIT SILVERS are offered. TYPES K and L exhibit low temperatures and fast cures. TYPES N and O are 100% solid systems which provide high electrical conductivity. MICROCIRCUIT SILVERS TYPE K,L,N, and O are designed for screen printing or automatic dispensing applications.
PROPERTIES
| | Type K | Type L | Type N | Type O |
| Uncured |
| Per Cent Silver | 75 | 73 | 70 | 77 |
| Solids (5) | 98 | 98 | 100 | 100 |
| Viscosity cps | 60,000 | 80,000 | 100,000 | 125,000 |
| Shelf Life-70℉(21.11℃) | > 6 months | > 6 months | 6 months | 6 months |
| Application | Automatic dispense | Screen Print /
dispense | Screen Print /
dispense | Screen Print |
| Cured |
| Serv. Temp Range | -50℃ to 175℃ (325℃ intermittent) | -60℃ to +200℃ (325℃ intermittent) |
| Electrical Resistivity | 5 x 10-4 | 2 x 10-3 | 6 x 10-4 |
Linear Coef. Therm
Exp. (cm/cm℃) | 5 x 10-5 |
Thermal Conductivity
(BTU hr/ft2/℉/in.) | 21 | 20 | 20 | 22 |
| Outgassing |
| 1000 hrs @100℃ | 0.05% | 0.05% | 0.09% | 0.08% |
| 1000 hrs @125℃ | 0.2% | 0.2% | 0.7% | 0.6% |
Bond Shear Strength
(psi) after cure | 1500 | > 1500 | 3500 | 1500 |
| aged 200 hrs @175℃ | > 1000 | > 1000 | 2750 | 1000 |
| Cure Schedule (Select Temp.) |
| 115℃ | 1 1/2 hrs | 1 1/2 hrs | --- | --- |
| 125℃ | 1 hr. | 1 hr. | --- | --- |
| 135℃ | 30 min | 30 min | 5 hrs | 5 hrs. |
| 150℃ | 15 min | 15 min | 1 1/2 hrs. | 1 1/2 hrs. |
| 175℃ | 5 min | 5 min | 30 min | 30 min |
| 300℃ | 15 sec | 15 sec. | --- | --- |
