INSUL-BOND EPOXY ADHESIVES
ONE-PART LOW TEMPERATURE CURING SYSTEMS
Insul-Bond Adhesives are solvent-free, low grassing epoxy formulations recommended for discrete component attachment, substrate mounting and lid sealing in the porduction of high reliability hybrid microcircuits. These adhesives provide multiple bonding of chips or components in a single operation while maintaining low processing temperatures. Subsequent thermal comperssion or ultrasonic bonding operations are feasible.
Insul-Bond Epoxy 13, 14 and 15 maintain minimal outgassing, high electrical resitivity and high bond strength to 200¡É operating temperatures. Compatibility with aluminum and other metallizations common to microelectronic devices is assured.
PROPERTIES
| Epoxy 13 | Epoxy 14 | Epoxy 15 |
Physical (Uncured) | | | |
Composition | 1-part/filled | 1-part/filled | 1-part/filled |
Color | Buff | Buff | Buff |
Solids | 100% | 100% | 100% |
Viscosity, cps | Thixotropic paste | Thixotropic pasted | Thixotropic pasted |
Shelf Life | 6 months | 6 months | 6 months |
Thermal Conductivity BTU/hr/ft2/in/¢µ | 4 | 12 | 4 |
Coef. Thermal Expansion in/in/¡É/x 10-6 | 30 | 23 | 30 |
Outgassing (post cure) 1000 hrs @125¡É | 0.4% | 0.35% | 0.4% |
Moisture Absorption 7 days immersion 25¡É | 0.05% | 0.16% | 0.05% |
Bond Strength (lap shear @25¡É) 125¡É to 1000 HRS 30 days H2O immersion | 2000 1500 2000 | 1500 1000 1500 | 2000 1500 --- |
Service Temp. Range continuous | -40¡É to +150¡É | -40¡É to +150¡É | -40¡É to +150¡É |
Electrical (cured) | | | |
Volume Resistivity (ohm-cm) | 1 x 1015 | 1 x 1015 | 1 x 1015 |
Dissipation Factor (1mc) | 0.01 | 0.02 | 0.01 |
Dielectric Constant (1mc) | 3.9 | 4.4 | 3.9 |
Dielectric Strength (v/mil) | 450 | 450 | 450 |
APPLICATION
Selection of Insul-Bond Epoxy 13, 14 and 15 is made on the basis of thermal conductivity and thermal dxpansion requirements. Application by screen printing techniques (180-225 mesh screen) or automatic dispensing is suggested. For maximum bond strengths and reproducibility, adhesive thickness of 1 1/2-2mil is recommended.
CURE SCHEDULE
FAST-15min @140¡É; MEDIUM-30min @115¡É; SLOW-1hr @100¡É