TITANIUM ETCHANT TFTN
Selective and controllable etchant for application in semiconductor fabrication and thin film microeletronics technology.
Titanium Etchant TFTN is intended for etching Ti film deposited on glass or SiO2 substrates. TFTN does not contain hydrofluoric acid.
COMPATIBILITY :
| Al | Au | Cr | Cu | Ni | Si | Si3N4 | SiO2 | Ti | W | GaAs | Ta/TaN |
Ti ETCH TFTN | Etch | Ok | Etch | Slight | Slight | Ok | Ok | Ok | Etch | Ok | Etch | Ok |
Etch = significant attack / Slight = Slight attack / Ok = No Attack / Surf ox = Surface Oxidation /
Corrode = Surface Corrosion
Selectivity of about 10:1 for "slight" and selectivity > 1000:1 for "ok" or "no attack"
PROPERTIES :
| Titanium Etchant TFTN
| |
Appearance | Clear Aqueous |
Operating Temperature | 20 ~ 50¡É |
Metallization | Most Metals Except Al |
Resist Compatibility | Nega & Posi |
Tank | Polyethylene / Polypropylene |
Etch Rate @ 70¡É | 10 ¡Ê/sec @70¡É |
Etch Rate @ 85¡É | 50 ¡Ê/sec @85¡É |
Shelf Life | 1 Year |
Toxicity | Strong Acid |
Flash Point | Non-Flammable |
• Storage : Room Temperature.