COPPER ETCHANT APS-100
TRANSENE Printed Circuit Copper Etchnat are ferric chloride solutions formulated with proprietary wetting antifoam plus chelating additives to optimize etching performance. Ferric chloride solutions are the most widely used etchants for copper, copper alloys and Kovar in printed circuit board applications. The etchant are highly compatible with commonly used photoresists (KPR, DYNACHEM, AZ, RISTON, SCREEN RESISTS, etc.) APS-100 copper etchant are formulated for controlled etching providing fine line definition suitable for Thin Film circuits. Additionally, compatibility with nickel and thn-lead solders is assured.
COMPATIBILITY :
| Al | Au | Cr | Cu | Ni | Si | Si3N4 | SiO2 | Ti | W | GaAs | Ta/TaN |
APS-100 | Ok | Ok | Ok | Etch | Slight | Ok | Ok | Ok | Ok | Slight | N/A | Ok |
Etch = significant attack / Slight = Slight attack / Ok = No Attack / Surf ox = Surface Oxidation /
Corrode = Surface Corrosion
Selectivity of about 10:1 for "slight" and selectivity > 1000:1 for "ok" or "no attack"
PROPERTIES :
| Copper Etchant APS-100
| |
Appearance | |
Operating Temperature | 30~40¡É |
Tank | Bath |
Resist compatibility | Nega & Posi |
Etch Rate @ 40¡É | 80 ¡Ê/sec |
pH | |
Rinse | Distilled, Dionized Water |
Shelf Life | 1 Year |
APPLICATION :
• After etching 8 oz. Cu metal/gal. Etch rates may become longer than desired. Addition of 500ml HCl (37%) per gallon of etchant will effectively increase etch rate and allow use of etchant to 70% solution exhaustion (14 oz. Cu metal/gal.)
• Agitation of work in the etchant bath is advisable and will increase etch rates and improve definition.