Cu ETCHANT 49-1
Copper Etchant 49-1Àº °í¼øµµÀÇ Á¦Ç°À¸·Î Cu, GaAsÀÇ Etching¿¡ »ç¿ëµÇ´Â Á¦Ç°ÀÔ´Ï´Ù. Cu 49-1Àº ¶ÇÇÑ lead free technology¿¡ ´ëÀÀÇϱâ À§ÇÏ¿© 100% tin°ú tin 97%-Silver 3%ÀÇ Solder¿¡ ´ëÇÏ¿© AttackÇÏÁö ¾Ê½À´Ï´Ù.
¶ÇÇÑ Gold, Nickel, Nickel-Vanadium alloys¿¡ ´ëÇØ¼µµ ¶Ù¾î³ Selectivity¸¦ °¡Áö°í ÀÖ½À´Ï´Ù.
COMPATIBILITY :
| Al | Au | Cr | Cu | Ni | Si | Si3N4 | SiO2 | Ti | W | GaAs | Ta/TaN |
Cu 49-1 | Ok | Ok | Ok | Etch | Ok | Ok | Ok | Ok | Ok | Ok | Etch | Ok |
Etch = significant attack / Slight = Slight attack / Ok = No Attack / Surf ox = Surface Oxidation /
Corrode = Surface Corrosion
Selectivity of about 10:1 for "slight" and selectivity > 1000:1 for "ok" or "no attack"
PROPERTIES :
| Copper Etchant 49-1
|  |
Appearance | Clear, Colorless liquid |
Operating Temperature | 30~40¡É |
Storage Temperature | 4.4 ~ 15.5¡É |
Resist compatibility | Nega & Posi |
Etch Rate @ 30¡É | 22 ¡Ê/sec |
pH | 6-7 |
Rinse | Distilled, Dionized Water |
Shelf Life | 1 Year |
APPLICATION :
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• Áö¼ÓÀûÀÎ agitationÀÌ ÇÊ¿äÇÕ´Ï´Ù.
• Cu 49-1Àº °í¼øµµÀÇ raw materials°ú 1018Mohm'cm resitivity DI Water¸¦ »ç¿ëÇÏ¿© Á¦Á¶µË´Ï´Ù.
• Á¦Ç°ÀÇ pH´Â Ammonium Hydroxide¸¦ Æ÷ÇÔÇÑ ¼öÄ¡ ÀÔ´Ï´Ù.