INSUL-BOND EPOXY ADHESIVES
Two-Part, Low Temperature Cure, High Peel Strength Systems
Insul-Bond 16 & 17 adhesives are solvent free, electrically non-conductive epoxy systems designed for die attachment, substrate mounting and lid sealing in hybrid microelectronics applications. These 2-part systems feature rapid cure at very low temperatures and outstanding bond "peel" strengths-typically 10 times greater than standard epoxy materials. Application by screen printing (180-225 SS mesh) or automatic dispensing is recommended.
PROPERTIES
| Epoxy 16 | Epoxy 17 |
Physical (Uncured) | | |
Composition | Two-part | Two-part |
Color | Tan | Tan |
Solids | 100% | 100% |
Viscosity. cps | 80,000 cps | 80,000 cps |
Shelf Life | 6 months | 4 months |
Pot Life | > 2 hours | > 2 hours |
Mixing Ration by weight A:B | 100(A)/7(B) | 100(A)/7(B) |
Physical (Cured) | | |
Bond Strength | | |
Sheer | 2,000 psi | 2,000 psi |
Peel | 80 pli | 80 pli |
Heat Distortion Temp. | > 125¡É | > 125¡É |
Outgassing (weight loss) 1000 hrs @125¡É | 0.35% | 0.35% |
High Temperature Storage: Peel Strength (125¡É) Peel Strength (150¡É) | > 70 pli > 70 pli | > 70 pli > 70 pli |
Thermal Conductivity BTU/hr/ft2/in/¢µ | 4 | 10 |
Coef. Thermal Expansion in/in/¡É/x 10-6 | 35 | 23 |
Service Temp. Range continuous | -40¡É to +150¡É | -40¡É to +150¡É |
Electrical (cured) | | |
Volume Resistvity (ohm-cm) | 1015 ohm/cm | 1015 ohm/cm |
Dissipation Factor (1mc) | 0.01 | 0.01 |
Dielectric Constant (1mc) | 3.3 | 3.3 |
Dielectric Strength (v/mil) | 500 v/mil | 500 v/mil |
CURE
Mix in ratio of 100 parts A to 7 part B (hardener). Select any cure schedule as follows
50¡É | 20 min. (minimum) | 20 min. (minimum) |
75¡É | 15 min. " | 15 min. " |
100¡É | 10 min. " | 10 min. " |