SILVER BOND
Low Temperature Thermosetting Silver
Epoxy silver compositions for conductive bonding in microelectronic assembly applications
SILVER BOND - Type 40
Standard low-temperature cure, high electrical conductivity
SILVER BOND - Type 50
Fast low-temperature cure, high electrical conductivity
SILVER BOND - Type 60
Long pot life, fast cure
FEATURES
• Low temperature curing systems
• High bond strength
• Electrical resistivity < 10-4 ohm-cm
• Low outgassing
• Long pot life
• Adhesive bonding to glass, metal, ceramic, plastics, graphite, quartz
SILVER BOND is a two component, epoxy based conductive adhesive for quality electrical and mechanical contacts. It provides high bond strength and excellent conductivity as well as low-temperature cure and long pot life. The product is designed for conductive bonding applications in microelectronics in place of lead tin solder or other alloys to avoid flux contamination or exposure to excessive temperature, and for process simplification. SILVER BOND Type 40 is especially recommended for bonding applications where it is desirable to keep process temperatures in the 100℃ range. SILVER BOND Type 50 is modified for faster curing applications. SILVER BOND Type 60 provides extended pot-life with fast cure at slightly elevated temperatures.
PROPERTIES
| | Type 40 | Type 50 | Type 60 |
| Composition | Silver Filled Epoxy |
| Consistency | Soft Thixotropic paste |
| Viscosity | 90,000 cps ± 10% |
| Elect. resitivity | 1 x 10-4 ohm-cm max. |
| Lap shear strength | 1500 psi nominal |
| Temperature stability range | -65℃ to +200℃ | -65℃ to +175℃ |
| Outgassing (postcure) | <0.1%100hr. @125℃ |
| Thermal conductivity | 80 BTU/in/ft2hr/℃ |
| Pot life | 6 hrs at 25℃ | 2 hrs @25℃ | 48 hrs @25℃ |
| Shelf life | one year @25℃ |
| Mixing ratio A:B (by wt.) | 100/3.6 | 100/2.5 |
| Cure (at 100℃) | 2 hrs | 10 minutes |
| Thinner | Butyl Cellosolve Acetate |
| Mixing ratio (A:B) | 100/3.6 | 100/2.5 |
| Part A | Part B | Part B | Part B |
| 1 gram | 0.036 gm (1 drop) | 0.024 gm (1 drop) | 1 drop |
| 5 grams | 0.180 gm (6 drops) | 0.124 gm (4 drops) | 4 drops |
| 1 oz. (28.35gm) | 1.023 gms (34 drops) | 0.76 gm (24drops) | 24 drops |
Cure schedule
(Time : Temperature Relationship) |
| 50℃ | --- | 30 minutes | --- |
| 75℃ | 2 1/2 hrs. | 15 minutes | --- |
| 100℃ | 2 hrs. | 10 minutes | 10 minutes |
| 125℃ | 1 1/2 hrs. | 5 minutes | 5 minutes |
| 150℃ | 1 hr. | --- | 2 minutes |
