POSITIVE RESIST REMOVER PRR 5-4
POSITIVE RESIST REMOVER PRR 5-4 is composed of a proprietary mixture of water miscible inorganic and organic alkaline ingredients. IT is specially formulated to remove(dissolve) common positive working photoresists treated with deep UV for ion implant, ion milling or plasma etch systems on various metal substrates.
PRR 5-4 Remover does not contain phosphates, chromates, phenol, or chlorinated hydrocarbons, and no special handling precautions are necessary. PRR 5-4 is compatible with all teflon, polypropylene and polyethylene materials. PRR 5-4 works well at room temperature or at slightly elevated temperatures for diffcult stripping situations. Use of PRR 5-4 will result in noticeable cost saving per wafer. PRR 5-4 should be stored in a cool area away from direct sunlight. The recommended shelf life is one year.
PROPERTIES :
| PRR 5-4
| |
Appearance | Clear liquid |
Specific Gravity @ 20¡É | 1.04 ¡¾ 0.02 |
pH @ 20¡É | Above 10.0 |
Shelf Life | 1 Year |
Clear liquid (nD 26.6¡É) | 1.4437 ¡¾ 0.0005 |
Filtration | 0.1 § |
Strip Temperature | 20 ¡É |
Removal Rate | 0.15 microns/minute |
APPLICATION :
• Bath Make Up : Full strength for most semiconductor operations.
• Rinse : PRR 5-4 is completely miscible with water; only rinse in deionized water.
• Bath Replenishment / Replacement :
1. Replenishment should be made to maintain capacity levels as needed.
2. Bath replacement should take place when removal time exceeds 20 minutes per tank.
• Bath Operation :
1. For standard resist processing (90-100¡É) : 20¡É for 3-5 minutes.
2. For deep UV and hardened resist processing (100-150¡É) : 55-90¡É for 5-10 minutes.